Semiconductor Package and Assembly Designer

What will your job look like:

• Define and specify advanced package architectures for digital SoCs and RF ICs in automotive applications.
• Perform substrate design for flip-chip BGA (FC-BGA) packages, including stack-up, routing, and ball-out optimizations.
• Evaluate and select substrate technologies, materials, and package solutions based on performance, cost, and reliability.
• Collaborate with OSATs to define and validate assembly materials and process flows.
• Work closely with internal teams such as Backend, SIPI, Product Engineering, and Quality & Reliability to ensure seamless integration.
• Monitor yield, quality, and manufacturability across package development and production stages.
• Support DFM reviews and ensure compliance with automotive standards and customer requirements

All you need is:

• B.Sc. or M.Sc. in Electrical Engineering, Materials Science, or a related field.
• 3+ years of experience in semiconductor package design and assembly.
• Deep knowledge of package design, substrate engineering, and simulation methodologies.
• Hands-on experience with package layout tools such as Cadence Allegro Package Designer or Xpedition Package Designer.
• Solid understanding of high-speed layout constraints (e.g., crosstalk, EMI, RFI) and proven experience with interfaces like DDR, PCIe, MIPI, and UFS.
• Strong background in schematic review, capture, and system-level integration.
• Proficiency in scripting for automation and design optimization with tools like MATLAB or Python – advantage.
• Proficiency in layout design verification tool such as CAM350- advantage.
• Experience working directly with OSATs – advantage.
• Proven experience with SIPI simulation tools like Ansys SIwave, Ansys HFSS,  Cadence Sigrity and Siemens HyperLynx – advantage.
• Proven experience with thermal or thermo-mechanical simulation tools like Cadence Celsius, Ansys Icepak, Ansys Mechanical and Flotherm - advantage.
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