Semiconductor Quality and Reliability Engineer

What will your job look like:

• Define and manage Quality and Reliability specifications, simulations, and qualification plans for SoC die and package.
• Plan and execute automotive-grade qualifications per standards such as AEC-Q100, JEDEC JESD22, and IATF 16949.
• Design and implement die-level and package-level stress tests.
• Select and prepare electrical, environmental, and mechanical test platforms for reliability testing.
• Define requirements for Pre-Si Q&R (e.g. ESD, LU, EM, IR drop), Design-for-Test (DFT), electrical characterization, and Post-Si Q&R testing of digital, mixed-signal and RF SoCs.
• Collaborate extensively with internal design teams, external subcontractors, and outsourcing partners (OSATs).
• Lead failure analysis, reliability modeling, and corrective action processes (e.g., 8D, FMEA, FMEDA).
• Document and certify automotive standards compliance, including PPAP/APQP deliverables.

All you need is:

• BSc/MSc in Electrical Engineering, Physics, or related field.
• 5+ years of experience in semiconductor Q&R, preferably with SoCs, ASICs, VLSI, or RF ICs.
• Strong knowledge of semiconductor physics, packaging technologies, materials and reliability mechanisms.
• Hands-on experience with Q&R test design and environmental stress testing.
• Deep understanding of failure prediction models, reliability simulations, and statistical analysis.
• High proficiency in English, including strong verbal, reading, and writing skills.
• Familiarity with RF reliability concerns – advantage.
• Expertise in automotive Q&R standards, including AEC-Q100, IATF 16949, and JEDEC/ISO/IEEE protocols -advantage.
• Experience with advanced packaging Q&R (e.g., WLCSP, FCBGA) -advantage.
• Exposure to radar or ADAS/AV automotive systems Q&R – advantage.